Indium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia. Five experts from Indium Corporation will present their cutting-edge research on Pb-free soldering solutions that address critical challenges in modern power electronics and advanced packaging applications.
Indium Corporation Strategic Advisor Dr. Dongkai Shangguan will deliver a keynote presentation, titled Materials and Reliability for Advanced Packaging and Heterogeneous Integration. The keynote will explore the increasing complexity of interconnect reliability in advanced packaging, driven by the demand for high-density, high-performance applications and the rise of heterogeneous integration.
Product Manager (Semiconductor) Dean Payne will deliver a presentation, titled Making the Move from High-Pb Solder to Pb-Free for Die-Attach in Discrete Power Devices. It will highlight the shift from traditional high-lead (Pb) solder to Pb-free alternatives for die attach applications in discrete power devices. This session will provide insights into the future of die attach solutions and how Indium Corporation is innovating to address these challenges and find a sustainable Pb-free solution for power discrete die attach.
研发烧结项目经理Demi Yao 将发表题为 "为下一代互连材料开发的有压和无压铜烧结浆料 "的演讲。本讲座将深入介绍为大功率应用开发的高可靠性铜（Cu）烧结浆料，它具有低成本、高导热性和导电性等主要优势，并且无需镀金或镀银等贵金属。
此外，电力电子产品经理助理Sunny Neoh将发表题为 "基板连接应用中的低温和中温无铅焊料预成型技术，以提高热机械性能 "的海报演讲。演讲将探讨用于高功率密度电子器件基板连接的低温和中温无铅焊料预成型技术的进展。报告还将重点介绍高可靠性合金（如 SAC-In、Sn-Sb 和 SAC-Sb）的开发情况，这些合金可承受热循环并提高大面积焊点的性能。
研究化学家 Mary Li Ma 还将发表题为 "四扁平无引线封装元件无铅焊接的空洞控制 "的海报演讲。该报告探讨了在四扁平无引线 (QFN) 封装中控制热垫空洞所面临的挑战，这对于尺寸、重量和热性能都很重要的应用来说至关重要。通过这项研究，开发出了一种低空洞浆料，为提高 QFN 性能提供了可靠的解决方案。
有关 Indium Corporations 无铅焊接解决方案的更多信息，请参观我们在 IEMT 的 1 号展位。
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
