As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout SMTA International (SMTAI), October 21-24, in Rosemont, Illinois.
10 月 21 日星期一
- Supercooled Solder Pastes in Low-Temperature Attach Applications 作者：吴一凡博士，伊恩-特维斯博士和拉迪卡-贾达夫合著
- This presentation discusses the use of metastable solder pastes as a solution for low-temperature soldering, enabling full metal interconnects at significantly lower temperatures. The study highlights the application of supercooled bismuth-tin (BiSn) pastes in next-generation electronics, where traditional high-temperature processing could cause material degradation.
10 月 23 日星期三
- Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components by Sr. Product Specialist Semiconductor and Advanced Assembly Materials, 埃文-格里菲斯由 ZESTRON Corporation 的 Ravi Parthasarathy 和 ITW EAE 的 Patrick Lawrence 合著
- This presentation will address the growing challenges in cleaning advanced packaging technologies, such as SiP, fcBGA, PoP, and 2.5D, as these designs incorporate larger die sizes, more bump counts, and lower standoff heights. The results will provide insights into optimization advantages, helping manufacturers reduce the risk of failures, improve efficiency, and ensure optimal cleaning consistency and repeatability.
10 月 24 日星期四
- Fluxless Reflow Technology for Combination Fine-Pitch and SMT-Level Component Attach 作者：埃文-格里菲斯，合著者：大卫-海勒、赵锡科、菲尔-莱勒，海勒工业公司
- This presentation will explore the challenges of miniaturization in electronics, particularly the difficulty of choosing an appropriate material for soldering in flux-free environments. This paper will introduce a novel tacky agent for use in formic acid reflow, and offer a material and equipment solution for customers looking to jointly use paste and flux in a formic acid reflow system for advanced packaging builds.
- Effects of Dynamic Warpage on the Solder Joints of Large Plastic Ball Grid Arrays Assembled with LTS by Francis Mutuku, co-authored by R&D Manager, Alloy Group, and Principal Metallurgist 张宏文博士王华光和泰勒-里士满
- The presentation explores the impact of dynamic warpage on solder joint reliability in large ball grid array (BGA) packages during reflow, testing, or service. There will be an emphasis on mitigating risk factors to ensure high-quality solder joints in large PBGA assemblies.
- 大型服务器集成电路翘曲和变形造成的焊接难题 由 罗纳德-拉斯基博士由高级销售和业务开发经理合著 克里斯-纳什 和区域产品经理 智慧曲
- 本讲座将重点讨论服务器 CPU/GPU 中使用的大尺寸集成电路封装（尤其是球栅阵列 (BGA) 格式）的翘曲所带来的挑战。会议将提出在电子组装中缓解这些问题的解决方案。
In addition, two Indium Corporation experts will serve as chairs for two extended sessions:
- On Tuesday, October 22, 8:30am – 10:00am, Dr. Lasky will chair the Solder Joint Reliability session.
- On Wednesday, October 23, 11:30am – 12:30pm, Dr. Mutuku will chair the Thermal Fatigue Reliability session
要了解有关 Indium Corporations 电力电子解决方案的更多信息，请务必参观我们在 SMTAI 上的 2300 号展台。
关于铟泰铟泰公司
铟泰公司 是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil 。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/.
