Indium Corporation introduces the Indium8.9 Solder Paste Series, which includes Indium8.9HFA and Indium8.9HF-1. These Pb-free and halogen-free solder pastes eliminate graping, head-in-pillow, and QFN defects.
Indium8.9HFA delivers unsurpassed print transfer efficiency to eliminate the insufficient. It also has excellent response-to-pause printing, as well as low voiding (<5%) over many different profiles when soldering BGAs with via-in-pad technology.
这两种焊膏都具有非常强大的加工窗口，可以最大限度地减少潜在缺陷，并适应各种电路板尺寸和产量要求。
Indium8.9HF-1 焊膏具有极高的热稳定性，可在回流焊后保持柔软的残留物。这意味着在在线测试过程中，探针测试更容易，错误剔除和探针堵塞的情况更少。
总之，Indium8.9 锡膏系列具有卓越的性能特点，可为客户节约成本并提高成品的可靠性。
Indium 将在 1A48 号展位展出。
有关 Indium8.9 焊膏的更多信息，请访问www.indium.com/big或发送电子邮件至 [email protected]。
