半导体焊膏

高温焊膏

Indium Corporation offers a comprehensive range of solder pastes, including semiconductor solder pastes with high-melting temperature alloys for semiconductor die-attach application. Our technical experts are on hand to help you choose the ideal solution. Our industry leading, high-Pb die-attach solder paste has a proven track record, meeting industrial and automotive reliability requirements. Specialized high-Pb, low-alpha emissivity solder alloys are available for automotive grade power MOSFETs. Innovative high-temperature, Pb-free solder Durafuse® HT is an alternative to high-Pb for die-attach. Gold-tin solder paste is the choice for a high-reliability, high thermal conductivity solder die-attach.

由铟泰公司提供支持

铅和无铅产品的广泛选择
专利合金技术
领先的专业技术

Green tubs labeled "Durafuse HT" from Indium Corporation, one tall with a nozzle, and one short with a screw cap—ideal for high temp solder paste applications.

产品概览

高温焊膏通常用于分立元件中半导体芯片的芯片连接。高温焊膏可承受 260°C 以上的熔化温度，确保在 PCBA 回流焊过程中不会再次熔化。

质量保证

我们的产品和制造工艺严格遵守 AEC-Q101 等汽车可靠性标准，可确保卓越的质量、连接完整性和长期性能。

多种合金选择

我们提供高铅、高铅低α和无铅选择，包括金锡和我们的专利 Durafuse® HT 合金技术。

与各种助焊剂飞行器兼容

无论是印刷还是点胶，无论是易清洁还是超低残留，我们的助焊剂系列都能优化性能，满足您应用的特定需求。

No Re-melting at PCBA Peak Reflow Temperatures

普通铅基合金的熔点在 295°C 至 312°C 之间，高温无铅合金的熔点在 340°C 左右，金锡膏的熔点约为 280°C。这些熔点可确保焊料在 PCBA 回流过程中保持完整。

高温焊膏

Commonly selected alloys. Other alloys are available.

Class	Alloy Name	组成	熔化温度	Powder Type*
High Pb	Indalloy®151	Pb5.0Sn2.5Ag	296°C	T3 & T4
High Pb	Indalloy®163	Pb2.5Sn2.0Ag	312°C	T3 & T4
High Pb	Indalloy®171	Pb5.0Sn	312°C	T3 & T4
无铅	Durafuse® HT	SnSbAgCu patented dual-alloy	~350°C	T4
无铅	Indalloy®183	80Au20Sn	280°C	T3 & T4