半导体焊膏
高温焊膏
Indium Corporation offers a comprehensive range of solder pastes, including semiconductor solder pastes with high-melting temperature alloys for semiconductor die-attach application. Our technical experts are on hand to help you choose the ideal solution. Our industry leading, high-Pb die-attach solder paste has a proven track record, meeting industrial and automotive reliability requirements. Specialized high-Pb, low-alpha emissivity solder alloys are available for automotive grade power MOSFETs. Innovative high-temperature, Pb-free solder Durafuse® HT is an alternative to high-Pb for die-attach. Gold-tin solder paste is the choice for a high-reliability, high thermal conductivity solder die-attach.
技术支持：铟泰公司
- 铅和无铅产品的广泛选择
- Patented Alloy Technology
- 领先的专业技术
产品概览
High-temperature solder pastes are typically used for the die-attach of semiconductor dies in discrete components. They are designed to withstand melting temperatures above 260°C, ensuring they do not re-melt during the PCBA reflow process.
质量保证
By adhering to stringent standards like AEC-Q101 for automotive reliability, our products and manufacturing processes ensure exceptional quality, joint integrity, and long-term performance.
多种合金选择
We offer high-Pb, high-Pb low alpha, and Pb-free options, including gold-tin and our patented Durafuse® HT alloy technology.
与各种助焊剂飞行器兼容
Whether for printing or dispensing, easy-to-clean or ultra-low residue, our range of flux is designed to optimize performance and meet the specific demands of your applications.
No Re-melting at PCBA Peak Reflow Temperatures
Common Pb-based alloys melt between 295°C and 312°C, high-temperature Pb-free alloys around 340°C, and gold-tin paste approximately 280°C. These melting points ensure the solder remains intact during the PCBA reflow process.
高温焊膏
Commonly selected alloys. Other alloys are available.
| Class | Alloy Name | 组成 | 熔化温度 | Powder Type* |
|---|---|---|---|---|
| High Pb | Indalloy®151 | Pb5.0Sn2.5Ag | 296°C | T3 & T4 |
| High Pb | Indalloy®163 | Pb2.5Sn2.0Ag | 312°C | T3 & T4 |
| High Pb | Indalloy®171 | Pb5.0Sn | 312°C | T3 & T4 |
| 无铅 | Durafuse® HT | SnSbAgCu patented dual-alloy | ~350°C | T4 |
| 无铅 | Indalloy®183 | 80Au20Sn | 280°C | T3 & T4 |
*Most commonly used. Other powder types are available.
产品数据表
WMA-SMQ69HT 高温水洗 PDS 97665 R8.pdf
铟6.91 高温水洗 PDS 99376 R1.pdf
相关应用
High-temperature solder pastes are suitable for a variety of applications.
相关市场
高熔点锡膏被广泛应用于各个市场。
相关产品
Durafuse®HT
高温无铅焊膏合金 HT。
半导体焊膏
Proven diverse range of semiconductor solder pastes.
金（Au） 合金 膏
免洗 水洗型 金（Au）-锡焊膏……
烧结材料
Pressure or pressureless silver or copper sinter…
Durafuse®HT
高温无铅焊膏合金 HT。
专家支持，结果可靠
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