Newsroom Archives - 2023
Welcome to Indium Corporation's newsroom archives. Here you will find Indium Corporation's global communications activities, as well as our media interviews.
Indium Corporation Announces Updates to Global Supply Chain Management Team
November 29, 2023
Indium Corporation is pleased to announce several key hires and promotions within its global Supply Chain Management team to ensure the efficient and timely delivery of materials for its customers. Markus Roas has joined the company as Business Unit Manager, Metals and Alexa Hornstein has been promoted to the role of Global Logistics & Trade Compliance Manager. Additionally, Michelle Rounsville and Stephen Swancott have been promoted to the positions of Strategic Sourcing Buyer and Global Logistics Specialist, respectively.
Indium Corporation’s Kevin Brennan Assumes Product Development Specialist Position
November 21, 2023
Indium Corporation is pleased to announce that Kevin Brennan has assumed a new role within the company as Product Development Specialist.
Indium Corporation to Host Special 2023 Recap, 2024 Predictions Session of EV InSIDER Live Webcast
November 21, 2023
In the final session of the year of Indium Corporation's free webcast series EV InSIDER Live on December 14, co-hosts Brian O'Leary and Loren McDonald will revisit the series' highlights from 2023 by exploring the industry's most significant developments and memorable interviews over the past 12 months.
Indium Corporation Announces Key Updates to Technical Service Team
November 15, 2023
Indium Corporation is pleased to announce two key updates to its industry-leading technical service team. Thuy Nguyen has been promoted to the position of Technical Support Engineer II and Liam Evans has joined the company as a Technical Support Engineer.
Indium Corporation Honored with Two Global Technology Awards at Productronica
November 15, 2023
Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.
Indium Corporation’s Jim McCoy Promoted to Product Manager
November 9, 2023
Indium Corporation is pleased to announce that Jim McCoy has been promoted to the position of Product Manager for Engineered Solder Materials (ESM).
Indium Corporation Introduces New Package-Attach Solder Preform Technology at Productronica
November 7, 2023
Indium Corporation® is proud to introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany. Specifically developed for power module package-attach applications, Indalloy®301-LT is a bismuth-free alloy that prevents thermal defects in the module without sacrificing reliability like traditional bismuth-containing, low-temperature alloys.
Indium Corporation Experts to Present at Productronica Forum
November 2, 2023
Two Indium Corporation experts are set to deliver technical presentations at the Productronica Forum on November 15 in Munich, Germany. The focus of the Forum is on trends and game changers for the SMT industry—from Industry 4.0 to artificial intelligence.
Indium Corporation to Exhibit Industry-Leading EV Products at Productronica
October 31, 2023
Indium Corporation® is proud to showcase its proven advanced assembly materials for PCBA and power electronics, including those for the rapidly evolving electric vehicle manufacturing and e-Mobility market, at Productronica, November 14-17, in Munich, Germany.
Solder Chemistry to Feature Solder Paste at Productronica
October 26, 2023
Solder Chemistry will feature two of its proven solder paste solutions at Productronica, November 14-17, in Munich, Germany.
Indium Corporation Earns Mexico Technology Award for Low-Voiding, Pb-Free Solder Paste
October 25, 2023
Indium Corporation has earned a Mexico Technology Award for its new low-voiding, Pb-free solder paste,Indium8.9HFRV. The award was presented during an awards ceremony on October 25 at the SMTA Guadalajara Expo and Tech Forum in Jalisco, Mexico.
Indium Corporation Celebrates Graduates of First Apprenticeship Class
October 18, 2023
Indium Corporation proudly celebrated the first eight graduates of its apprenticeship program during an event at the company's Lincoln Avenue facility in Utica on October 18. Also present at the celebration were representatives from external program partners including the Manufacturers Association of Central New York (MACNY) and Mohawk Valley Community College (MVCC).
Indium Corporation’s Rick Short Honored with Genesis Group’s Legacy Award
October 17, 2023
Indium Corporation Corporate Associate Vice President Rick Short was named by the Genesis Group as a 2023 Joseph R. Carucci Legacy Award honoree. Short and three fellow honorees in the 2023 class were recognized during the Genesis Group’s annual meeting and luncheon at Hart’s Hill Inn on October 12th.
Indium Corporation Expert Receives SMTA Technical Distinction Award
October 11, 2023
Indium Corporation R&D Manager of the Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang was presented with SMTA's prestigious Technical Distinction Award during an awards ceremony on October 9 at SMTA International in Minneapolis, MN. The Technical Distinction Award recognizes individuals who have made significant and continuing technical contributions to SMTA over a period of at least three years.
Indium Corporation Recognized by Electronics Maker for Best Soldering Product of the Year
October 5, 2023
Indium Corporation was recently the proud recipient of Electronics Maker's prestigious Best of Industry Award 2023 for Best Soldering Product of the Year. The award was received for Indium Corporation's InFORMS® reinforced solder preforms.
Indium Corporation Acquires SAFI-Tech to Advance Low-Temperature Soldering Technology
October 3, 2023
Indium Corporation, an international electronics materials refiner, smelter, manufacturer, and supplier, is proud to announce the acquisition of SAFI-Tech, a metal microcapsule technology innovator specializing in supercooling technology.
Indium Corporation’s Wisdom Qu to Present at iNEMI Workshop on Automotive Electronics
October 2, 2023
Indium Corporation Regional Product Manager Wisdom Qu will present at the iNEMI Workshop on Automotive Electronics on October 13, in Shenzhen, China.
Indium Corporation’s Wisdom Qu to Present at SMTA China South Technical Conference
September 28, 2023
Indium Corporation Regional Product Manager Wisdom Qu will present at the SMTA China South Technical Conference, held in conjunction with NEPCON Asia, on October 11 in Shenzhen, China.
Indium Corporation Experts to Present at IMAPS International Symposium on Microelectronics
September 27, 2023
Indium Corporation is proud to count three of its experts amongst the presenters participating in the technical program at the upcoming IMAPS International Symposium on Microelectronics, October 3-5 in San Diego, California, U.S.
Indium Corporation Engineer to Present at LED Meets SMT
September 26, 2023
Indium Corporation Junior Application Engineer Siegfried Lorenz will present at the 2023 LED Meets SMT forum on October 25 in Leinfelden-Echterdingen. The forum, featuring innovative presentations by partners from across the industry, focuses on the processing of LEDs in electronics manufacturing.
Indium Corporation Expert to Present During Power Electronics Webinar Hosted by EPP
September 21, 2023
Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present as part of EPP's free web session on power electronics on October 19.
Indium Corporation to Feature Solutions for Thermal Management and Advanced Packaging at IMAPS Symposium
September 20, 2023
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics October 3-4, in San Diego, California.
Indium Corporation e-Mobility Expert Joins Upcoming EV Panels Hosted by IPC
September 19, 2023
Indium Corporation Global Head of e-Mobility and Infrastructure and Chair of the IPC e-Mobility Quality & Reliability Advisory Council Brian O'Leary is set to hit the road, participating in two upcoming EV panel presentations hosted by IPC.
Indium Corporation Expert to Present on Low-Temperature Solder Paste at SMTA Empire Expo
September 14, 2023
Indium Corporation R&D Manager, Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang will present at the SMTA Empire Expo & Tech Forum on September 26 in Syracuse, NY. Also at the conference, Regional Sales Manager Emily Belfield will host a panel discussion, Generational Differences in Today's Workplace.
Indium Corporation Expert to Present at iNEMI Seminar Hosted by Zestron Germany
September 13, 2023
Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present at iNEMI's upcoming seminar, Humidity Robustness and Isolation Coordination for e-Mobility. The seminar, hosted by ZESTRON Europe, will be held on September 27 in Ingolstadt, Germany.
Indium Corporation Announces Updates to R&D Team
September 6, 2023
Indium Corporation is pleased to announce several key promotions within its Research and Development (R&D) team. Dr. Jie Geng has been promoted to the role of Senior Research Metallurgist, while Dr. Sihai Chen, Dr. Guangyu Fan, and Jim Hevel have all been promoted to the role of Senior Research Chemist.
Indium Corporation to Exhibit Leading EV Products at The Battery Show
August 29, 2023
Indium Corporation® is proud to showcase its proven products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at The Battery Show, September 12-14, in Novi, Michigan.
Indium Corporation’s Jason Chou to Present at SEMICON Taiwan
August 28, 2023
Indium Corporation Senior Area Technical Manager Jason Chou will present at SEMICON Taiwan on September 7, in Taipei, Taiwan.
Indium Corporation to Showcase Proven EV Products at productronica India
August 24, 2023
Indium Corporation® is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at productronica India, September 13-15, in Bengalaru. A strong supporter of the Make in India campaign, Indium Corporation is committed to serving the region's growing EV market.
Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan
August 23, 2023
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Indium Corporation to Host Live EV Webcast with Ford VP
August 22, 2023
In a special episode of Indium Corporation's free webcast series EV InSIDER Live, co-hosts Brian O'Leary and Loren McDonald will interview Darren Palmer, Vice President, Electric Vehicle Programs, Ford Model e, on the floor of The Detroit Auto Show. This unique session, titled How Ford is Driving the EV Revolution: An Exclusive Interview, will be broadcast live via LinkedIn on September 14, 11:30 a.m. EDT.
Indium Corporation’s Dr. Ronald Lasky to Conduct Three-Part Series on Defeating Defects in Electronics Assembly
August 15, 2023
Indium Corporation Senior Technologist Dr. Ronald Lasky will host a three-part webinar series, Defeating Defects in Electronics Assembly (SMT Process), as part of the company's free InSIDER Series. Part I will be held on September 12 at 10 a.m. EDT. Parts two and three will be held at the same time on October 17 and November 14, respectively.
Indium Corporation Experts to Present at SMTA High Reliability and Conformal Coating Conference
August 10, 2023
The upcoming SMTA High Reliability Cleaning and Conformal Coating Conference, taking place August 29-31 in Dallas, Texas, U.S., will feature presentations by two Indium Corporation experts. Both presentations will take place on August 31.
Indium Corporation to Supply High-Quality Gallium Acetylacetonate
August 8, 2023
Indium Corporation® is proud to be a global supplier of high-quality, high-purity gallium acetylacetonate, also known as Ga(acac)3. Ga(acac)3 is an organometallic coordination complex, with gallium at the center surrounded by three acetylacetonate ligands, which has several applications in materials science, organic chemistry, and catalysis due to its versatility and stability.
Indium Corporation to Present, Exhibit at PCIM Asia
August 2, 2023
Indium Corporation is set to deliver a technical presentation and exhibit its industry-leading products for power electronics assembly at PCIM Asia, August 29-31, in Shanghai, China.
Indium Corporation Announces Job Fair to Fill Immediate Openings
July 20, 2023
Indium Corporation will conduct a job fair on August 1 at the Burrstone Inn, 1777 Burrstone Road in New Hartford, from 11 a.m. – 7 p.m. On-site offers will be made to qualified candidates along with a $200 sign-on bonus, subject to terms.
Indium Corporation to Host Free Webcast Exploring Chinese EV Supremacy
July 12, 2023
The next episode of Indium Corporation's free webcast series EV InSIDER Live, titled Unveiling China's EV and Battery Supremacy: Insights from Industry Veteran Michael Dunne, is set to premier on Thursday, July 20 at 11:30 a.m. EST.
Indium Corporation Included in Smithsonian Exhibit on Cellphone Technology
July 11, 2023
As an advanced materials innovator and a premier global supplier to the mobile device assembly market, Indium Corporation is proud to be included in the Smithsonian National Museum of Natural History's Cellphone: Unseen Connections special exhibit in Washington D.C., on display through 2026.
Indium Corporation Earns IEEE Outstanding Industry Award for Innovative Solder Preforms
July 6, 2023
Indium Corporation has earned the IEEE Malaysia Section Outstanding Industry Award (Innovation) for its InFORMS® brand of reinforced solder preforms. The award was presented during a ceremony on June 24 in Kuala Lumpur, Malaysia.
Indium Corporation to Sponsor, Participate at IEMI Pune
July 5, 2023
As a proud Gold Sponsor of IPC's Integrated Electronics Manufacturing & Interconnections (IEMI) 2023, advanced materials innovator Indium Corporation is pleased to exhibit innovative materials for e-Mobility and share technical expertise in Pune, India on August 3.
Indium Corporation Experts to Present at SMTA China East Technical Conference
June 29, 2023
The upcoming SMTA China East Technical Conference will feature presentations by four Indium Corporation experts. The conference, which takes place July 19-20, is being held in conjunction with NEPCON China at the Shanghai World Expo Exhibition & Convention Center. In addition to presenting, Senior Area Technical Manager – East China Leo Hu will serve as Conference Chairman for the July 20 sessions.
Indium Corporation to Host Webinar on LED Device Assembly
June 22, 2023
Indium Corporation's Evan Griffith, Product Specialist for Semiconductor and Advanced Assembly Materials, will host two webinars about the increasing complexity of LED device assembly as part of the company's free InSIDER Series. The webinars, focusing on the same topic area, will premier on July 18 at 9 a.m. ET and July 19 at 9 p.m. ET.
Indium Corporation to Feature Products for HIA and SiP at CHIPcon
June 20, 2023
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative products designed to meet the evolving challenges of HIA and SiP at the Chiplet and Heterogeneous Integration Packaging Conference and Exhibition (CHIPcon) hosted by IMAPS, July 24-27, in San Jose, CA.
Indium Corporation Welcomes Internship Class of 2023
June 7, 2023
Indium Corporation is honored to kick off its award-winning summer internship program with 13 new college students in the company's 2023 class.
Indium Corporation Expert Honored by IEEE EPS
June 6, 2023
Indium Corporation Strategic Advisor Dr. Dongkai Shangguan was honored by the IEEE Electronics Packaging Society (EPS) with its 2023 Electronics Manufacturing Technology Award at the 73rd Electronics Components and Technology Conference (ECTC) in Orlando, FL.
Indium Corporation Expert to Deliver Keynote at NordPac
May 30, 2023
Indium Corporation Strategic Advisor Dr. Dongkai Shangguan is scheduled to deliver a keynote presentation at NordPac, hosted by IMAPS, June 12-14, in Oslo, Norway.
Indium Corporation Expert to Present at EPP InnovationsFORUM
May 25, 2023
Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch is set to deliver a presentation at EPP InnovationsFORUM on June 29 in Leinfelden-Echterdingen, Germany.
Indium Corporation to Sponsor, Moderate IPC e-Mobility Webinar Series
May 24, 2023
Indium Corporation is proud to sponsor the four-part e-Mobility Electronics Hardware Reliability Webinar Series,hosted by IPC and moderated by Brian O'Leary, the company's Global Head of e-Mobility and Infrastructure and Chair of the IPC e-Mobility Quality & Reliability Advisory Council. The webinar series will bring together industry leaders to discuss the hurdles in achieving reliability for emerging e-Mobility technology. Reliability drivers, technology applications, and target lifecycles will be examined.
Indium Corporation Senior Research Chemist to Present at CSTIC
May 23, 2023
Indium Corporation senior research chemist Mary Ma is set to deliver a technical presentation titled Printable Copper Sintering Paste for High-Power Die-Attach Applications at CSTIC, taking place in Shanghai, June 26-27.
Indium Corporation’s Dr. Ronald Lasky to Conduct Workshops on Lean Six Sigma for Electronics Assembly
May 18, 2023
Indium Corporation senior technologist Dr. Ronald Lasky has been tapped by SMTA to conduct a three-part workshop, titled Solving Real-Life Problems Using the Tools of Lean Six Sigma, in conjunction with Jim Hall, Principal SMT Consultant with ITM Consulting. The first session will be held on May 31 at 3 p.m. EDT. Parts two and three will be held at the same time on June 7 and June 21, respectively. All sessions will be conducted virtually.
Indium Corporation’s Jenny Gallery Promoted to Senior Product Specialist
May 16, 2023
Indium Corporation is pleased to announce that Jenny Gallery has been promoted to Senior Product Specialist.
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at International Microwave Symposium
May 11, 2023
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, San Diego, Calif., June 11–16.
Indium Corporation Introduces New Low-Voiding Pb-Free Solder Paste
May 9, 2023
Indium Corporation® is proud to introduce Indium8.9HFRV, a flux vehicle developed from the industry-leading Indium8.9HF chemistry. It features exceptional low-voiding performance while providing excellent stencil print transfer efficiency and response-to-pause performance.
Indium Corporation Expert to Present on Low-Temperature Solder Paste at ECTC
May 2, 2023
Indium Corporation R&D Manager, Alloy Group Dr. HongWen Zhang is scheduled to deliver a presentation at the 73rd Electronic Components and Technology Conference (ECTC), June 1, in Orlando, FL. The presentation will examine the findings from a technical paper titled A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application That Outperforms SAC305.
Solder Chemistry to Participate in the Fraunhofer Future Packaging Production Line at SMTconnect
May 1, 2023
Solder Chemistry, an Indium Corporation company, will feature its proven solder paste solutions as part of the prestigious Fraunhofer Future Packaging production line exhibition at SMTconnect, May 9-11 in Nuremberg, Germany.
Indium Corporation Joins India Electronics and Semiconductor Association
April 27, 2023
Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the India Electronics and Semiconductor Association (IESA).
Indium Corporation to Feature Innovative Materials for Power Electronics at PCIM
April 25, 2023
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, May 9-11, in Nuremberg, Germany. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
Indium Corporation to Host Battery-Focused EV InSIDER Live Webcast
April 19, 2023
The next episode of Indium Corporation’s free webcast series EV InSIDER Live, titled e-Mobility Batteries: The Next Frontier of Sustainability and the Circular Economy, is set to premier on Thursday, May 11, at 11:30 a.m. EST.
Indium Corporation Experts to Present on Power Electronics at PCIM Europe
April 18, 2023
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 9-11, in Nuremberg, Germany.
Indium Corporation Receives EM World's Innovation Award for New Halogen-Free, Cleanable Solder Paste
April 17, 2023
Indium Corporation has earned Electronics Manufacturing (EM) World's Innovation Award for SiPaste® C201HF, a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing processes, as seen with 01005 and 008004 components.
Indium Corporation Joins European Center for Power Electronics
April 13, 2023
Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Center for Power Electronics (ECPE), the leading industrial and research network for power electronics in Europe. Through its involvement with the organization, Indium Corporation continues to position itself as a premier materials provider, as well as thought leader, in the European power electronics market.
Indium Corporation Introduces New Global Accounts Team Member
April 12, 2023
Indium Corporation is pleased to announce that Tomás Paulos has joined the company as an Assistant Global Accounts Manager.
Indium Corporation Announces New High-Reliability, Low-Temperature Alloy
April 11, 2023
Indium Corporation® has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability.
Indium Corporation’s Jenny Gallery to Present at HiTEC
April 4, 2023
Indium Corporation's senior product specialist Jenny Gallery will deliver a presentation at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico. The presentation, scheduled for April 20, will cover the findings from a technical paper titled AuSn Preform Thickness's Effect on Thermal Management in Semiconductor Laser Applications.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at productronica China
April 3, 2023
Indium Corporation® is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market, including cutting-edge high-reliability alloys, at productronica China, April 13-15, in Shanghai.
Indium Corporation’s Sze Pei Lim to Present at ICEP Japan
March 30, 2023
Indium Corporation's Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto, Japan, on April 19. The presentation will cover the findings from a technical paper, co-authored by R&D Manager for the Alloy Group HongWen Zhang, titled An In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305.
Indium Corporation Set to Launch Second Season of EV InSIDER Live Webcast Series
March 29, 2023
Following a successful inaugural season which included six episodes and five high-profile guests from the EV industry, Indium Corporation's EV InSIDER Live webcast series is set to launch its second season on April 13. EV InSIDER Liveis co-hosted by Indium Corporation's global head of e-Mobility and infrastructure, Brian O'Leary, and Loren McDonald, EV consultant and CEO of EVAdoption.
Indium Corporation to Feature Gold Products at HiTEC
March 28, 2023
As one of the industry's foremost providers of Au-based products, Indium Corporation® will proudly feature its high-temperature and high-reliability gold solder solutions at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico, April 18-20. Among its featured Au-based products, Indium Corporation will showcase its AuLTRA™ ThInFORMS™—0.00035" thick (0.00889mm or 8.89μm) 80Au/20Sn preforms.
Indium Corporation's Dr. Ronald Lasky to Present at SMTA Houston
March 24, 2023
Indium Corporation senior technologist Dr. Ronald Lasky will deliver a technical presentation on low-temperature solder at SMTA Houston on March 30.
Indium Corporation’s Brian O’Leary to Participate in Panel Workshop at The Assembly Show South
March 22, 2023
Indium Corporation's Brian O'Leary, global head of e-Mobility and infrastructure, will present as part of a panel workshop at The Assembly Show South, on April 4, in Nashville, Tennessee. Scheduled for 1:30-4:30 p.m., the workshop is titled Vehicle Electrification and U.S. Manufacturing: Building the EV While We Drive It. O'Leary will be joined on the panel by Debbie Carboni (KYZEN Corporation), Brian Chislea (Dow Chemical Company), and Dwight Howard (formerly with APTIV LPC).
Indium Corporation’s Dr. Andy Mackie to Present as Part of iNEMI Packaging Series
March 21, 2023
Indium Corporation's Principal Engineer and Manager for Thermal Interface Materials Applications Dr. Andy Mackie, Ph.D., will deliver a webinar presentation as part of the International Electronics Manufacturing Initiative's (iNEMI) Packaging Tech Topic Series on Tuesday, March 28.
Indium Corporation to Host Webinar on Optimizing sTIM Processes for HIA
March 16, 2023
Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimizing reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous integrated assembly (HIA) packages. The webinar, a part of the company's InSIDER Series, will be held live at 2:00 p.m. (EST), March 30, and made available for on-demand viewing afterward.
Indium Corporation’s Andreas Karch to Present at IMAPS Spring Seminar
March 15, 2023
Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch is set to present as part of the upcoming IMAPS Spring Seminar, March 23, in Ilmenau, Germany. The 2023 Spring Seminar will focus on sustainability in electronics production.
Indium Corporation’s Brian O’Leary to Present at EV Charging Infrastructure USA 2023
March 15, 2023
Indium Corporation's Brian O'Leary, global head of e-Mobility and infrastructure, will present at EV Charging Infrastructure USA 2023. The event, which will take place March 29–30 in Anaheim, CA, is the only event of its kind to deliver leading market intelligence and industry presentations on the latest EV charging infrastructure projects to support the expansion of electric vehicles.
Indium Corporation Joins American Semiconductor Innovation Coalition to Advance U.S. Leadership in Technology Supply Chains
March 14, 2023
Advanced materials innovator Indium Corporation today announced they have joined the American Semiconductor Innovation Coalition (ASIC). ASIC recently expanded its membership to include representatives from all stages of the chip fabrication supply chain, including packaging (interconnection and protection of the semiconductor chip). Indium Corporation will be joining fellow technology innovators focused on advancing U.S. leadership in the research and development of semiconductor technology.
Two Indium Corporation Experts to Present at APEC
March 8, 2023
Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster titled Highly Reliable Silver Sintering Joints for Power Module Applications, while Product Manager Joe Hertline will deliver a presentation titled A Novel Material Technology that Reduces Tooling Dependency and Process Complexity in Power Module Soldering and Sintering Applications.
Indium Corporation to Feature Products for HIA and SiP at IMAPS Device Packaging Conference
March 7, 2023
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative products designed to meet the evolving challenges of SiP and HIA at the 19th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 13‒16, in Fountain Hills, AZ.
Indium Corporation to Feature Innovative Solutions from Portfolio of Thermal Management Products at SEMI-THERM
March 2, 2023
Indium Corporation® will feature an array of innovative thermal management solutions at SEMI-THERM, March 13‒17, in San Jose, CA.
Two Indium Corporation Experts to Participate at IMAPS Device Packaging Conference
March 1, 2023
The upcoming 19th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium Corporation experts. Product Manager (Semiconductor) Dean Payne will deliver a presentation on pressure copper sinter paste for die-attach in power electronics devices while Dr. Andy Mackie, Principal Engineer and Manager for Thermal Interface Materials Applications, is set to chair a special invited session.
Indium Corporation to Present Technical Paper at SEMI-THERM
February 28, 2023
Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen will present a technical paper at SEMI-THERM, taking place March 13–17 in San Jose, CA.
Indium Corporation Engineers Achieve 100% SMTA Certification and Historic High Score
February 23, 2023
Indium Corporation is proud to continue its legacy of producing the highest quality technical support engineers, benefitting both its global customer base as well as the surface mount technology (SMT) industry. This legacy is evidenced by its current tally of 36 SMTA (Surface Mount Technology Association) certified employees as well as the impressive accomplishment of Technical Engineer Carson Burt, who recently achieved a score of 98%—the highest in SMTA history—while earning his SMTA CSMTPE (certified surface mount technology process engineer) certification.
Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX
February 21, 2023
Indium Corporation® will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 5-8 in Mesa, Ariz., U.S.
Indium Corporation Introduces New Product Manager
February 16, 2023
Indium Corporation is pleased to announce that Amanda Hartnett has joined the company as Product Manager for Engineered Solder Materials (ESM).
Indium Corporation to Showcase High-Reliability Products for Power Electronics and EV at APEC
February 9, 2023
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2023, March 19‒23 in Orlando, Florida.
Indium Corporation to Host Webinar on Material Technology for Power Module Soldering and Sintering
February 7, 2023
Indium Corporation's Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the ability to provide robust tacking strength while reducing dependency on customized fixturing. The webinar, a part of the company's InSIDER Series, will be held live at 8:30 a.m. (EST), Tuesday, February 28 and made available for on-demand viewing afterward.
Indium Corporation Introduces China Country Sales Manager
February 2, 2023
Indium Corporation is pleased to introduce Taylor Wang Yong Xing as the company’s China Country Sales Manager.
Indium Corporation to Participate at 3D-PEIM, Feature Innovative Products for Power Electronics
January 25, 2023
Indium Corporation® will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1‒3 in Miami, Florida. In addition, Indium Corporation’s Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.
Indium Corporation Earns CIRCUITS ASSEMBLY New Product Introduction Award
January 24, 2023
Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its flux-cored wire, CW-818. The award was presented during a ceremony at IPC APEX Expo on January 24 in San Diego, Calif., U.S.
Indium Corporation Announces Strategic Partnership with ABIC Kemi AB, Lindberg & Lund OY AB
January 19, 2023
Indium Corporation is pleased to announce the formation of a strategic partnership with two materials distributors in Europe to better serve the company’s customers in Sweden, Denmark, and Finland.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
January 18, 2023
Indium Corporation®, through coordination with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Jan. 24‒26 in San Diego, Calif., U.S.
Indium Corporation to Feature Innovative Products for Automotive and Power Electronics Applications at NEPCON Japan
January 17, 2023
Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January 25‒27 in Tokyo, Japan.
Five Indium Corporation Experts to Present at IPC APEX Expo
January 12, 2023
Indium Corporation's technical experts will share a variety of presentations on topics ranging from e-Mobility, achieving low voiding through solder preforms, high-performance metal thermal interface materials, low-temperature solder alloys, and low-temperature solder paste for wafer-level packaging at IPC APEX Expo, Jan. 24-26, San Diego, Calif., U.S.
Indium Corporation Features Metal Thermal Interface Materials and Flux-Cored Wire at IPC APEX Expo
January 10, 2023
Indium Corporation® will feature its compressible metal thermal interface materials (TIMs) and award-winning flux-cored wire at IPC APEX Expo, Jan. 24-26, in San Diego, Calif., US.
Indium Corporation Hires New Plant Manager for Chicago Facility
January 4, 2023
Indium Corporation is pleased to announce the addition of Srinevassa Ramsundar as Plant Manager at its Chicago facility.
Indium Corporation Hires New Senior Manager for Corporate Quality
January 3, 2023
Indium Corporation is pleased to announce that Robert Atwood has joined the company as senior manager corporate quality.