Indium Corporation's Brian O'Leary, global head of e-Mobility and infrastructure, will present as part of a panel workshop at The Assembly Show South, on April 4, in Nashville, Tennessee. Scheduled for 1:30-4:30 p.m., the workshop is titled Vehicle Electrification and U.S. Manufacturing: Building the EV While We Drive It. O'Leary will be joined on the panel by Debbie Carboni (KYZEN Corporation), Brian Chislea (Dow Chemical Company), and Dwight Howard (formerly with APTIV LPC). 

Indium Corporation's Principal Engineer and Manager for Thermal Interface Materials Applications Dr. Andy Mackie, Ph.D., will deliver a webinar presentation as part of the International Electronics Manufacturing Initiative's (iNEMI) Packaging Tech Topic Series on Tuesday, March 28. 

Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimizing reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous integrated assembly (HIA) packages. The webinar, a part of the company's InSIDER Series, will be held live at 2:00 p.m. (EST), March 30, and made available for on-demand viewing afterward. 

Indium Corporation's Brian O'Leary, global head of e-Mobility and infrastructure, will present at EV Charging Infrastructure USA 2023. The event, which will take place March 29–30 in Anaheim, CA, is the only event of its kind to deliver leading market intelligence and industry presentations on the latest EV charging infrastructure projects to support the expansion of electric vehicles. 

Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch is set to present as part of the upcoming IMAPS Spring Seminar, March 23, in Ilmenau, Germany. The 2023 Spring Seminar will focus on sustainability in electronics production.

Advanced materials innovator Indium Corporation today announced they have joined the American Semiconductor Innovation Coalition (ASIC). ASIC recently expanded its membership to include representatives from all stages of the chip fabrication supply chain, including packaging (interconnection and protection of the semiconductor chip). Indium Corporation will be joining fellow technology innovators focused on advancing U.S. leadership in the research and development of semiconductor technology. 

Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster titled Highly Reliable Silver Sintering Joints for Power Module Applications, while Product Manager Joe Hertline will deliver a presentation titled A Novel Material Technology that Reduces Tooling Dependency and Process Complexity in Power Module Soldering and Sintering Applications.  

As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation^® will feature innovative products designed to meet the evolving challenges of SiP and HIA at the 19^th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 13‒16, in Fountain Hills, AZ. 

Indium Corporation^® will feature an array of innovative thermal management solutions at SEMI-THERM, March 13‒17, in San Jose, CA.  

The upcoming 19^th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium Corporation experts. Product Manager (Semiconductor) Dean Payne will deliver a presentation on pressure copper sinter paste for die-attach in power electronics devices while Dr. Andy Mackie, Principal Engineer and Manager for Thermal Interface Materials Applications, is set to chair a special invited session. 

Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen will present a technical paper at SEMI-THERM, taking place March 13–17 in San Jose, CA. 

Indium Corporation is proud to continue its legacy of producing the highest quality technical support engineers, benefitting both its global customer base as well as the surface mount technology (SMT) industry. This legacy is evidenced by its current tally of 36 SMTA (Surface Mount Technology Association) certified employees as well as the impressive accomplishment of Technical Engineer Carson Burt, who recently achieved a score of 98%—the highest in SMTA history—while earning his SMTA CSMTPE (certified surface mount technology process engineer) certification. 

Indium Corporation^® will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 5-8 in Mesa, Ariz., U.S.

Indium Corporation is pleased to announce that Amanda Hartnett has joined the company as Product Manager for Engineered Solder Materials (ESM).  

Indium Corporation^® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2023, March 19‒23 in Orlando, Florida. 

Indium Corporation's Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the ability to provide robust tacking strength while reducing dependency on customized fixturing. The webinar, a part of the company's InSIDER Series, will be held live at 8:30 a.m. (EST), Tuesday, February 28 and made available for on-demand viewing afterward. 

Indium Corporation is pleased to introduce Taylor Wang Yong Xing as the company’s China Country Sales Manager. 

Indium Corporation^® will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1‒3 in Miami, Florida. In addition, Indium Corporation’s Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.  

Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its flux-cored wire, CW-818. The award was presented during a ceremony at IPC APEX Expo on January 24 in San Diego, Calif., U.S.

Indium Corporation is pleased to announce the formation of a strategic partnership with two materials distributors in Europe to better serve the company’s customers in Sweden, Denmark, and Finland. 

Indium Corporation^®, through coordination with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Jan. 24‒26 in San Diego, Calif., U.S.

Indium Corporation^® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicles, at NEPCON Japan, January 25‒27 in Tokyo, Japan. 

Indium Corporation's technical experts will share a variety of presentations on topics ranging from e-Mobility, achieving low voiding through solder preforms, high-performance metal thermal interface materials, low-temperature solder alloys, and low-temperature solder paste for wafer-level packaging at IPC APEX Expo, Jan. 24-26, San Diego, Calif., U.S.

Indium Corporation^® will feature its compressible metal thermal interface materials (TIMs) and award-winning flux-cored wire at IPC APEX Expo, Jan. 24-26, in San Diego, Calif., US.  

Indium Corporation is pleased to announce the addition of Srinevassa Ramsundar as Plant Manager at its Chicago facility.

Indium Corporation is pleased to announce that Robert Atwood has joined the company as senior manager corporate quality.