November 29, 2023
Indium Corporation is pleased to announce several key hires and promotions within its global Supply Chain Management team to ensure the efficient and timely delivery of materials for its customers. Markus Roas has joined the company as Business Unit Manager, Metals and Alexa Hornstein has been promoted to the role of Global Logistics & Trade Compliance Manager. Additionally, Michelle Rounsville and Stephen Swancott have been promoted to the positions of Strategic Sourcing Buyer and Global Logistics Specialist, respectively.
November 21, 2023
November 21, 2023
In the final session of the year of Indium Corporation's free webcast series EV InSIDER Live on December 14, co-hosts Brian O'Leary and Loren McDonald will revisit the series' highlights from 2023 by exploring the industry's most significant developments and memorable interviews over the past 12 months.
November 15, 2023
November 15, 2023
Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.
November 9, 2023
November 7, 2023
Indium Corporation® is proud to introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany. Specifically developed for power module package-attach applications, Indalloy®301-LT is a bismuth-free alloy that prevents thermal defects in the module without sacrificing reliability like traditional bismuth-containing, low-temperature alloys.
November 2, 2023
October 31, 2023
October 26, 2023
October 25, 2023
October 18, 2023
Indium Corporation proudly celebrated the first eight graduates of its apprenticeship program during an event at the company's Lincoln Avenue facility in Utica on October 18. Also present at the celebration were representatives from external program partners including the Manufacturers Association of Central New York (MACNY) and Mohawk Valley Community College (MVCC).
October 17, 2023
Indium Corporation Corporate Associate Vice President Rick Short was named by the Genesis Group as a 2023 Joseph R. Carucci Legacy Award honoree. Short and three fellow honorees in the 2023 class were recognized during the Genesis Group’s annual meeting and luncheon at Hart’s Hill Inn on October 12th.
October 11, 2023
Indium Corporation R&D Manager of the Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang was presented with SMTA's prestigious Technical Distinction Award during an awards ceremony on October 9 at SMTA International in Minneapolis, MN. The Technical Distinction Award recognizes individuals who have made significant and continuing technical contributions to SMTA over a period of at least three years.
October 5, 2023
October 3, 2023
October 2, 2023
September 28, 2023
September 27, 2023
September 26, 2023
September 21, 2023
Indium Corporation to Feature Solutions for Thermal Management and Advanced Packaging at IMAPS Symposium
September 20, 2023
September 19, 2023
September 14, 2023
Indium Corporation R&D Manager, Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang will present at the SMTA Empire Expo & Tech Forum on September 26 in Syracuse, NY. Also at the conference, Regional Sales Manager Emily Belfield will host a panel discussion, Generational Differences in Today's Workplace.
September 13, 2023
Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present at iNEMI's upcoming seminar, Humidity Robustness and Isolation Coordination for e-Mobility. The seminar, hosted by ZESTRON Europe, will be held on September 27 in Ingolstadt, Germany.
September 6, 2023
Indium Corporation is pleased to announce several key promotions within its Research and Development (R&D) team. Dr. Jie Geng has been promoted to the role of Senior Research Metallurgist, while Dr. Sihai Chen, Dr. Guangyu Fan, and Jim Hevel have all been promoted to the role of Senior Research Chemist.
August 29, 2023
August 28, 2023
August 24, 2023
Indium Corporation® is proud to showcase its innovative products and expertise for the rapidly evolving electric vehicle manufacturing and e-Mobility market at productronica India, September 13-15, in Bengalaru. A strong supporter of the Make in India campaign, Indium Corporation is committed to serving the region's growing EV market.
Indium Corporation to Showcase Innovative Solutions for Thermal Management and Power Electronics at SEMICON Taiwan
August 23, 2023
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
August 22, 2023
In a special episode of Indium Corporation's free webcast series EV InSIDER Live, co-hosts Brian O'Leary and Loren McDonald will interview Darren Palmer, Vice President, Electric Vehicle Programs, Ford Model e, on the floor of The Detroit Auto Show. This unique session, titled How Ford is Driving the EV Revolution: An Exclusive Interview, will be broadcast live via LinkedIn on September 14, 11:30 a.m. EDT.
Indium Corporation’s Dr. Ronald Lasky to Conduct Three-Part Series on Defeating Defects in Electronics Assembly
August 15, 2023
Indium Corporation Senior Technologist Dr. Ronald Lasky will host a three-part webinar series, Defeating Defects in Electronics Assembly (SMT Process), as part of the company's free InSIDER Series. Part I will be held on September 12 at 10 a.m. EDT. Parts two and three will be held at the same time on October 17 and November 14, respectively.
August 10, 2023
The upcoming SMTA High Reliability Cleaning and Conformal Coating Conference, taking place August 29-31 in Dallas, Texas, U.S., will feature presentations by two Indium Corporation experts. Both presentations will take place on August 31.
August 8, 2023
Indium Corporation® is proud to be a global supplier of high-quality, high-purity gallium acetylacetonate, also known as Ga(acac)3. Ga(acac)3 is an organometallic coordination complex, with gallium at the center surrounded by three acetylacetonate ligands, which has several applications in materials science, organic chemistry, and catalysis due to its versatility and stability.
August 2, 2023
July 20, 2023
Indium Corporation will conduct a job fair on August 1 at the Burrstone Inn, 1777 Burrstone Road in New Hartford, from 11 a.m. – 7 p.m. On-site offers will be made to qualified candidates along with a $200 sign-on bonus, subject to terms.
July 12, 2023
The next episode of Indium Corporation's free webcast series EV InSIDER Live, titled Unveiling China's EV and Battery Supremacy: Insights from Industry Veteran Michael Dunne, is set to premier on Thursday, July 20 at 11:30 a.m. EST.
July 11, 2023
As an advanced materials innovator and a premier global supplier to the mobile device assembly market, Indium Corporation is proud to be included in the Smithsonian National Museum of Natural History's Cellphone: Unseen Connections special exhibit in Washington D.C., on display through 2026.
July 6, 2023
July 5, 2023
As a proud Gold Sponsor of IPC's Integrated Electronics Manufacturing & Interconnections (IEMI) 2023, advanced materials innovator Indium Corporation is pleased to exhibit innovative materials for e-Mobility and share technical expertise in Pune, India on August 3.
June 29, 2023
The upcoming SMTA China East Technical Conference will feature presentations by four Indium Corporation experts. The conference, which takes place July 19-20, is being held in conjunction with NEPCON China at the Shanghai World Expo Exhibition & Convention Center. In addition to presenting, Senior Area Technical Manager – East China Leo Hu will serve as Conference Chairman for the July 20 sessions.
June 22, 2023
Indium Corporation's Evan Griffith, Product Specialist for Semiconductor and Advanced Assembly Materials, will host two webinars about the increasing complexity of LED device assembly as part of the company's free InSIDER Series. The webinars, focusing on the same topic area, will premier on July 18 at 9 a.m. ET and July 19 at 9 p.m. ET.
June 20, 2023
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative products designed to meet the evolving challenges of HIA and SiP at the Chiplet and Heterogeneous Integration Packaging Conference and Exhibition (CHIPcon) hosted by IMAPS, July 24-27, in San Jose, CA.
June 7, 2023
June 6, 2023
May 30, 2023
May 25, 2023
May 24, 2023
Indium Corporation is proud to sponsor the four-part e-Mobility Electronics Hardware Reliability Webinar Series,hosted by IPC and moderated by Brian O'Leary, the company's Global Head of e-Mobility and Infrastructure and Chair of the IPC e-Mobility Quality & Reliability Advisory Council. The webinar series will bring together industry leaders to discuss the hurdles in achieving reliability for emerging e-Mobility technology. Reliability drivers, technology applications, and target lifecycles will be examined.
May 23, 2023
Indium Corporation’s Dr. Ronald Lasky to Conduct Workshops on Lean Six Sigma for Electronics Assembly
May 18, 2023
Indium Corporation senior technologist Dr. Ronald Lasky has been tapped by SMTA to conduct a three-part workshop, titled Solving Real-Life Problems Using the Tools of Lean Six Sigma, in conjunction with Jim Hall, Principal SMT Consultant with ITM Consulting. The first session will be held on May 31 at 3 p.m. EDT. Parts two and three will be held at the same time on June 7 and June 21, respectively. All sessions will be conducted virtually.
May 16, 2023
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at International Microwave Symposium
May 11, 2023
May 9, 2023
May 2, 2023
Indium Corporation R&D Manager, Alloy Group Dr. HongWen Zhang is scheduled to deliver a presentation at the 73rd Electronic Components and Technology Conference (ECTC), June 1, in Orlando, FL. The presentation will examine the findings from a technical paper titled A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application That Outperforms SAC305.
May 1, 2023
April 27, 2023
April 25, 2023
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, May 9-11, in Nuremberg, Germany. Indium Corporation's products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.
April 19, 2023
The next episode of Indium Corporation’s free webcast series EV InSIDER Live, titled e-Mobility Batteries: The Next Frontier of Sustainability and the Circular Economy, is set to premier on Thursday, May 11, at 11:30 a.m. EST.
April 18, 2023
Indium Corporation Receives EM World's Innovation Award for New Halogen-Free, Cleanable Solder Paste
April 17, 2023
April 13, 2023
Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Center for Power Electronics (ECPE), the leading industrial and research network for power electronics in Europe. Through its involvement with the organization, Indium Corporation continues to position itself as a premier materials provider, as well as thought leader, in the European power electronics market.
April 12, 2023
April 11, 2023
Indium Corporation® has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability.
April 4, 2023
Indium Corporation's senior product specialist Jenny Gallery will deliver a presentation at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico. The presentation, scheduled for April 20, will cover the findings from a technical paper titled AuSn Preform Thickness's Effect on Thermal Management in Semiconductor Laser Applications.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at productronica China
April 3, 2023
March 30, 2023
Indium Corporation's Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto, Japan, on April 19. The presentation will cover the findings from a technical paper, co-authored by R&D Manager for the Alloy Group HongWen Zhang, titled An In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305.
March 29, 2023
Following a successful inaugural season which included six episodes and five high-profile guests from the EV industry, Indium Corporation's EV InSIDER Live webcast series is set to launch its second season on April 13. EV InSIDER Liveis co-hosted by Indium Corporation's global head of e-Mobility and infrastructure, Brian O'Leary, and Loren McDonald, EV consultant and CEO of EVAdoption.
March 28, 2023
As one of the industry's foremost providers of Au-based products, Indium Corporation® will proudly feature its high-temperature and high-reliability gold solder solutions at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico, April 18-20. Among its featured Au-based products, Indium Corporation will showcase its AuLTRA™ ThInFORMS™—0.00035" thick (0.00889mm or 8.89μm) 80Au/20Sn preforms.
March 24, 2023
March 22, 2023
Indium Corporation's Brian O'Leary, global head of e-Mobility and infrastructure, will present as part of a panel workshop at The Assembly Show South, on April 4, in Nashville, Tennessee. Scheduled for 1:30-4:30 p.m., the workshop is titled Vehicle Electrification and U.S. Manufacturing: Building the EV While We Drive It. O'Leary will be joined on the panel by Debbie Carboni (KYZEN Corporation), Brian Chislea (Dow Chemical Company), and Dwight Howard (formerly with APTIV LPC).
March 21, 2023
Indium Corporation's Principal Engineer and Manager for Thermal Interface Materials Applications Dr. Andy Mackie, Ph.D., will deliver a webinar presentation as part of the International Electronics Manufacturing Initiative's (iNEMI) Packaging Tech Topic Series on Tuesday, March 28.
March 16, 2023
Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimizing reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous integrated assembly (HIA) packages. The webinar, a part of the company's InSIDER Series, will be held live at 2:00 p.m. (EST), March 30, and made available for on-demand viewing afterward.
March 15, 2023
March 15, 2023
Indium Corporation's Brian O'Leary, global head of e-Mobility and infrastructure, will present at EV Charging Infrastructure USA 2023. The event, which will take place March 29–30 in Anaheim, CA, is the only event of its kind to deliver leading market intelligence and industry presentations on the latest EV charging infrastructure projects to support the expansion of electric vehicles.
Indium Corporation Joins American Semiconductor Innovation Coalition to Advance U.S. Leadership in Technology Supply Chains
March 14, 2023
Advanced materials innovator Indium Corporation today announced they have joined the American Semiconductor Innovation Coalition (ASIC). ASIC recently expanded its membership to include representatives from all stages of the chip fabrication supply chain, including packaging (interconnection and protection of the semiconductor chip). Indium Corporation will be joining fellow technology innovators focused on advancing U.S. leadership in the research and development of semiconductor technology.
March 8, 2023
Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster titled Highly Reliable Silver Sintering Joints for Power Module Applications, while Product Manager Joe Hertline will deliver a presentation titled A Novel Material Technology that Reduces Tooling Dependency and Process Complexity in Power Module Soldering and Sintering Applications.
March 7, 2023
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative products designed to meet the evolving challenges of SiP and HIA at the 19th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 13‒16, in Fountain Hills, AZ.
Indium Corporation to Feature Innovative Solutions from Portfolio of Thermal Management Products at SEMI-THERM
March 2, 2023
March 1, 2023
The upcoming 19th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium Corporation experts. Product Manager (Semiconductor) Dean Payne will deliver a presentation on pressure copper sinter paste for die-attach in power electronics devices while Dr. Andy Mackie, Principal Engineer and Manager for Thermal Interface Materials Applications, is set to chair a special invited session.
February 28, 2023
February 23, 2023
Indium Corporation is proud to continue its legacy of producing the highest quality technical support engineers, benefitting both its global customer base as well as the surface mount technology (SMT) industry. This legacy is evidenced by its current tally of 36 SMTA (Surface Mount Technology Association) certified employees as well as the impressive accomplishment of Technical Engineer Carson Burt, who recently achieved a score of 98%—the highest in SMTA history—while earning his SMTA CSMTPE (certified surface mount technology process engineer) certification.
February 21, 2023
February 9, 2023
February 7, 2023
Indium Corporation's Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the ability to provide robust tacking strength while reducing dependency on customized fixturing. The webinar, a part of the company's InSIDER Series, will be held live at 8:30 a.m. (EST), Tuesday, February 28 and made available for on-demand viewing afterward.
February 2, 2023
Indium Corporation is pleased to introduce Taylor Wang Yong Xing as the company’s China Country Sales Manager.
January 25, 2023
Indium Corporation® will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1‒3 in Miami, Florida. In addition, Indium Corporation’s Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.
January 24, 2023
Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its flux-cored wire, CW-818. The award was presented during a ceremony at IPC APEX Expo on January 24 in San Diego, Calif., U.S.
January 19, 2023
Indium Corporation is pleased to announce the formation of a strategic partnership with two materials distributors in Europe to better serve the company’s customers in Sweden, Denmark, and Finland.
January 18, 2023
Indium Corporation to Feature Innovative Products for Automotive and Power Electronics Applications at NEPCON Japan
January 17, 2023
January 12, 2023
Indium Corporation's technical experts will share a variety of presentations on topics ranging from e-Mobility, achieving low voiding through solder preforms, high-performance metal thermal interface materials, low-temperature solder alloys, and low-temperature solder paste for wafer-level packaging at IPC APEX Expo, Jan. 24-26, San Diego, Calif., U.S.
January 10, 2023
January 4, 2023
Indium Corporation is pleased to announce the addition of Srinevassa Ramsundar as Plant Manager at its Chicago facility.
January 3, 2023
Indium Corporation is pleased to announce that Robert Atwood has joined the company as senior manager corporate quality.