Tin whiskers are thinner than a human hair, but these electrically-conductive structures have been known to cause sudden failures and intermittent problems due to their ability to short closely spaced electronic circuits.

On Tuesday, Oct. 19, Indium Corporation’s Ron Lasky, Ph.D., PE, senior technologist, will host a webinar on these crystalline structures of tin at 10 a.m. San Francisco/1 p.m. New York/6 p.m. London/7 p.m. Germany as part of the company’s free webinar program, the InSIDER Series.

Indium Corporation’s Dr. Ron Lasky, senior technologist, will host a webinar on the fundamentals of Weibull distribution and analysis on Thursday, July 29 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London on Indium Corporation’s webinar program, the InSIDER Series. 

Indium Corporation continues to expand its flux portfolio with WS-823—a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. 

Indium Corporation’s Claire Hotvedt, CSMPTE, Product Development Specialist, will present on the company’s innovative low-temperature solder offering during the virtual Low-Temperature Soldering Conference, at 3:30 p.m. Eastern/8:30 p.m. British, June 16.

At Indium Corporation, we believe that materials science changes the world. In recognition of the notable material behind our name, we will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49th element.

Plating with indium metal can be utilized for a number of diverse applications that take advantage of its unique physical and chemical properties.  

Two of Indium Corporation’s experts will present in the virtual International Conference for Electronics Hardware Enabling Technologies (ICEHET) virtual conference, hosted by SMTA Toronto, June 2-3.  

Indium Corporation has honored five of its employees for their industry contributions with its annual Silver Quill Award. 

Indium Corporation will present on preparing graphite sheets to enhance their thermal conductivity during the Electronic Components and Technology Conference (ECTC), to be held virtually from June 1-July 4.  

Indium Corporation’s Donna Vareha-Walsh, director of sales and global supply chain and trade compliance, has taken on her new role as the chair of the Minor Metals Trade Association (MMTA) Board of Directors.

Indium Corporation has more than 50 immediate openings for Production Operators, plus many other positions at its Utica, Rome, and Clinton facilities and is offering prospective employees the opportunity for immediate interviews as part of its job fair from 9 a.m. to 3 p.m., Wednesday, May 19, at the Delta by Marriott in Utica.

Indium Corporation will feature products from its SiP portfolio at SiP Conference China, May 21, Shanghai, China.

Indium Corporation’s Leo Hu, senior area technical manager - East China, will present on fine feature solder paste printing for SiP at SiP Conference China, May 21, Shanghai, China.

Indium Corporation’s Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim, will present a paper on low-temperature first level interconnects during the virtual ICEP, May 12-14.

Indium Corporation, a global electronics materials refiner, smelter, manufacturer, and supplier, announced today that Solder Chemistry, a German producer of soldering technology, is now part of the Indium Corporation family. The joining of these two companies further expands Indium Corporation’s reach in the European electronics market and creates an extended platform for Solder Chemistry’s distinctive product offerings and technology. Each company will continue to offer products and solutions via its established sales and service networks.

Indium Corporation’s Dr. Ron Lasky, Senior Technologist, has created a new SMT IQ Test for new or veteran industry professionals looking for a fun way to measure their surface mount technology (SMT) knowledge.

At Indium Corporation, we believe that materials science changes the world. In recognition of the notable material behind our name, we will release monthly installments of the Elements of Indium Series—an educational program to raise awareness of the unique applications, abundance, and interesting properties of the 49th element.

Liquid metals can be mysterious to many people as they challenge the mental stereotypes we have about metal. In most cases, liquid metals are too hot to handle due to the elevated temperature needed to transform the metal from a solid to a liquid. Gallium-indium alloys are unique—they remain liquid at room temperature, making them ideal for a number of emerging applications.

Indium Corporation’s Andy Mackie, PhD, MSc, Principal Engineer and Manager, Thermal Interface Materials Applications, will host a Webex webinar focused on the thermal management market in high-performance applications as part of Indium Corporation’s InSIDER Series on April 28 at 9 a.m. Eastern/2 p.m. British.  

Three of Indium Corporation’s experts will share their industry knowledge and insight during SMTA China East Technology Conference, April 21-22 in Shanghai, China. This event is held in conjunction with NEPCON China 2021at the Shanghai World Expo Exhibition & Convention Centre.

Indium Corporation has earned the Circuits Assembly New Product Introduction (NPI) Award for its new flux-cored wire for robotic and laser soldering. The award was presented on Tuesday, April 6 during a virtual ceremony.

Three Indium Corporation experts will share their industry knowledge during the 17th Annual Device Packaging Conference (DPC 2021) organized by IMAPS, from April 12-15.

Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for its new flux-cored wire for robotic and laser soldering. The award was presented on Thursday, March 18 in Shanghai, China, during Productronica China.

Indium Corporation’s Claire Hotvedt, CSMPTE, Product Development Specialist, will host a Webex webinar focused on its innovative low-temperature solder offering as part of Indium Corporation’s ongoing webinar series April 6 at 8 p.m. Eastern (5 p.m. Pacific/April 7 at 8 a.m. Singapore). 

Indium Corporation’s Joe Hertline, Product Manager – ESM/Power Electronics, will present on power electronics for electric vehicles during the CHARGED EV Engineering Virtual Conference on Wednesday, April 21.

Indium Corporation is offering newly-hired applicants a $500 sign-on bonus as it aims to fill 50 production operator positions at its facilities in Utica, Rome, and Clinton.

Indium Corporation will feature the award-winning Durafuse™ LT–the novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications–during Productronica China, held March 17-19 in Shanghai, China.

Indium Corporation will feature its uniquely formulated flux-cored wire during the virtual IPC APEX Expo, to be held March 8-12.

Indium Corporation’s newest jetting solder paste, PicoShot® NC-5M, has received official approval from Mycronic as a qualified jetting solder paste. PicoShot® NC-5M and its associated purging gel are designed for customers needing a halogen-free no-clean SAC305 solder paste for their Mycronic jetting systems or add-on and repair modules.

Indium Corporation’s Meagan Sloan, CSMTPE, Technical Support Engineer, will host an InSIDER Series webinar on stencil printing fundamentals in two sessions on Tuesday, March 2 at Noon Eastern Time (5 p.m. British Time) and Thursday, March 4 at 9 a.m. Eastern Time (2 p.m. British Time).  

Indium Corporation’s Product Development Specialist Miloš Lazić will share his industry knowledge on thermal interface materials (TIMs) at the virtual IPC APEX Expo, to be held March 8-12.

Indium Corporation’s Kim Flanagan, Technical Support Engineer, will host an InSIDER Series webinar on reflow fundamentals in two sessions on Wednesday, Feb. 10 at 9 a.m. Eastern Time (2 p.m. British Time) and Tuesday, Feb. 16 at 9 a.m. Eastern Time (2 p.m. British Time).  

Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will host an InSIDER Series webinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 26 at 8 p.m. Eastern Time/Wednesday, Jan. 27 at 9 a.m. Singapore Time.

Indium Corporation’s Dr. HongWen Zhang, R&D Manager, Alloy Group, will host webinar on the ongoing evolution of lead-free solder alloys via WebEx on Tuesday, Jan. 19 at 10 a.m. Eastern Time/3 p.m. British Time.