Newsroom

Newsroom Archives - 2023

Welcome to Indium Corporation's newsroom archives. Here you will find Indium Corporation's global communications activities, as well as our media interviews.
Indium Corporation’s Brian O’Leary to Participate in Panel Workshop at The Assembly Show South news photo
Indium Corporation’s Brian O’Leary to Participate in Panel Workshop at The Assembly Show South
March 22, 2023
Indium Corporation's Brian O'Leary, global head of e-Mobility and infrastructure, will present as part of a panel workshop at The Assembly Show South, on April 4, in Nashville, Tennessee. Scheduled for 1:30-4:30 p.m., the workshop is titled Vehicle Electrification and U.S. Manufacturing: Building the EV While We Drive It. O'Leary will be joined on the panel by Debbie Carboni (KYZEN Corporation), Brian Chislea (Dow Chemical Company), and Dwight Howard (formerly with APTIV LPC). 
Indium Corporation’s Brian O’Leary to Present at EV Charging Infrastructure USA 2023 news photo
Indium Corporation’s Brian O’Leary to Present at EV Charging Infrastructure USA 2023
March 15, 2023
Indium Corporation's Brian O'Leary, global head of e-Mobility and infrastructure, will present at EV Charging Infrastructure USA 2023. The event, which will take place March 29–30 in Anaheim, CA, is the only event of its kind to deliver leading market intelligence and industry presentations on the latest EV charging infrastructure projects to support the expansion of electric vehicles. 
Indium Corporation Joins American Semiconductor Innovation Coalition to Advance U.S. Leadership in Technology Supply Chains news photo
Indium Corporation Joins American Semiconductor Innovation Coalition to Advance U.S. Leadership in Technology Supply Chains
March 14, 2023
Advanced materials innovator Indium Corporation today announced they have joined the American Semiconductor Innovation Coalition (ASIC). ASIC recently expanded its membership to include representatives from all stages of the chip fabrication supply chain, including packaging (interconnection and protection of the semiconductor chip). Indium Corporation will be joining fellow technology innovators focused on advancing U.S. leadership in the research and development of semiconductor technology. 
Two Indium Corporation Experts to Present at APEC  news photo
Two Indium Corporation Experts to Present at APEC
March 8, 2023
Two Indium Corporation experts are set to present at APEC 2023, March 19-23, in Orlando, FL. Senior Research Chemist Dr. Sihai Chen will present a technical poster titled Highly Reliable Silver Sintering Joints for Power Module Applications, while Product Manager Joe Hertline will deliver a presentation titled A Novel Material Technology that Reduces Tooling Dependency and Process Complexity in Power Module Soldering and Sintering Applications.  
Indium Corporation to Feature Products for HIA and SiP at IMAPS Device Packaging Conference news photo
Indium Corporation to Feature Products for HIA and SiP at IMAPS Device Packaging Conference
March 7, 2023
As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative products designed to meet the evolving challenges of SiP and HIA at the 19th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 13‒16, in Fountain Hills, AZ. 
Two Indium Corporation Experts to Participate at IMAPS Device Packaging Conference news photo
Two Indium Corporation Experts to Participate at IMAPS Device Packaging Conference
March 1, 2023
The upcoming 19th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium Corporation experts. Product Manager (Semiconductor) Dean Payne will deliver a presentation on pressure copper sinter paste for die-attach in power electronics devices while Dr. Andy Mackie, Principal Engineer and Manager for Thermal Interface Materials Applications, is set to chair a special invited session. 
Indium Corporation Engineers Achieve 100% SMTA Certification and Historic High Score news photo
Indium Corporation Engineers Achieve 100% SMTA Certification and Historic High Score
February 23, 2023
Indium Corporation is proud to continue its legacy of producing the highest quality technical support engineers, benefitting both its global customer base as well as the surface mount technology (SMT) industry. This legacy is evidenced by its current tally of 36 SMTA (Surface Mount Technology Association) certified employees as well as the impressive accomplishment of Technical Engineer Carson Burt, who recently achieved a score of 98%—the highest in SMTA history—while earning his SMTA CSMTPE (certified surface mount technology process engineer) certification. 
Indium Corporation to Host Webinar on Material Technology for Power Module Soldering and Sintering news photo
Indium Corporation to Host Webinar on Material Technology for Power Module Soldering and Sintering
February 7, 2023
Indium Corporation's Joe Hertline, Product Manager for Engineered Solder Materials (ESM)/Power Electronics, will host a webinar to discuss an emerging material technology which has the ability to provide robust tacking strength while reducing dependency on customized fixturing. The webinar, a part of the company's InSIDER Series, will be held live at 8:30 a.m. (EST), Tuesday, February 28 and made available for on-demand viewing afterward. 
Indium Corporation to Participate at 3D-PEIM, Feature Innovative Products for Power Electronics news photo
Indium Corporation to Participate at 3D-PEIM, Feature Innovative Products for Power Electronics
January 25, 2023
Indium Corporation® will feature selections from its portfolio of proven products for power electronics applications at the International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), February 1‒3 in Miami, Florida. In addition, Indium Corporation’s Principal Engineer and Manager for the Thermal Interface Materials Applications, Dr. Andy Mackie, will chair a technical session on interconnects and lead attachments on February 2.