Newsroom Archives - 2022
Welcome to Indium Corporation's newsroom archives. Here you will find Indium Corporation's global communications activities, as well as our media interviews.
Indium Corporation Introduces New Technical Support Engineer Brian Rundell
June 28, 2022
Indium Corporation is pleased to announce that Brian Rundell has joined the company as a Technical Support Engineer based at the company’s headquarters in Clinton, New York.
Indium Corporation Nominated for Top 100 Internship Programs
June 23, 2022
Indium Corporation is encouraging the public to vote for its internship program as one of the Top 100 Internship Programs in the nation.
EV Experts to Share Technical Insights in Automotive Electronics Webinar
June 21, 2022
As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion™ Technical Webinars, Indium Corporation’s EV experts are excited to announce the third webinar in this series.
The third session in the Driving e-Mobility:
Rel-ion™ Technical Webinar series is scheduled for June 28 with two opportunities to participate: the first at 8:30 a.m. Germany/12 p.m. India/2:30 p.m. China and Malaysia, and the second at 10 a.m. San Francisco/1 p.m. New York/6 p.m. London/7 p.m. Germany. This webinar, titled Increased Reliability for Higher Mission Profiles in Automotive Electronics, will feature Technical Manager for Europe, Africa, and the Middle East Karthik Vijay.
Indium Corporation Introduces Dawn Ponton as Global Accounts Manager, e-Mobility & Infrastructure
June 17, 2022
Indium Corporation is pleased to announce that Dawn Ponton has joined the company as Global Accounts Manager, e-Mobility & Infrastructure.
Indium Corporation Announces Silver Quill Award Winners
June 16, 2022
Indium Corporation has honored six of its employees for their industry contributions with its annual Silver Quill Award.
Indium Corporation’s Brian O’Leary to co-host EV Insider Live Webcast Series
June 15, 2022
Indium Corporation’s global head of e-Mobility and infrastructure Brian O’Leary and co-host Loren McDonald are excited to launch a new webcast series, EV Insider Live. Conducted in an approachable, conversational format suitable for business executives, casual observers, and seasoned engineers alike, EV Insider Live will shed light on the most pressing issues from across the dynamic and rapidly evolving electric vehicle landscape. O’Leary and McDonald will be joined by a different high-profile guest from the EV industry on each episode.
Indium Corporation Introduces AuSn Pastes for High-Power LEDs
June 9, 2022
Indium Corporation® has expanded its portfolio of proven pastes with two new AuSn pastes designed for the higher processing temperatures and assembly needs required for use in high-power LED module array applications, such as automotive, infrastructure, and horticulture.
Indium Corporation’s Dawn Roller Provides Keynote Address at SABA Student Breakfast
June 8, 2022
Indium Corporation’s Associate Vice President of Human Resources, Dawn Roller, provided the keynote address at the School and Business Alliance’s (SABA) annual breakfast, hosted by Oneida-Herkimer-Madison BOCES, on Tuesday, June 7.
Indium Corporation to Feature Proven Products at iMAPS SiP Conference
June 7, 2022
Indium Corporation will feature products from its portfolio of system-in-package material solutions at the Advanced System in Package Technology Conference & Exhibition, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), on Tuesday, June 21 in Sonoma, Calif., U.S.
Indium Corporation Announces Job Fair, Immediate Openings
June 2, 2022
Indium Corporation continues to offer area job seekers the chance to explore opportunities with Utica’s Technology Company® through its upcoming job fair on Thursday, June 9, from Noon – 7:30 p.m., at 592 Hangar Road in Rome (located in the Griffiss Business & Technology Park).
Indium Corporation to Showcase Durafuse™ Technology at EPP InnovationsFORUM
June 1, 2022
Indium Corporation® will showcase its innovative Durafuse™ technology at the EPP InnovationsFORUM on Tuesday, June 28 in Leinfelden-Echterdingen, Germany.
Indium Corporation Introduces New Ultra-Low Residue Flip-Chip Flux at ECTC
May 31, 2022
Indium Corporation® will introduce NC-809, a new halogen-free, ultra-low residue, flip-chip flux at the Electronic Components and Technology Conference (ECTC), May 31-June 3, San Diego, Calif., U.S. Engineered with high-tack characteristics, NC-809 is designed to hold die or solder spheres in place without risk of die shift during the assembly process.
Indium Corporation Welcomes Internship Class of 2022
May 26, 2022
Indium Corporation is honored to commence its summer internship program with 18 new college students in the company's 2022 class.
Indium Corporation Expert to Present at Delsys Tech Day
May 24, 2022
Indium Corporation's Andreas Karch, technologist – advanced application and technical manager for Germany, Austria, and Switzerland, will present as part of Delsys Tech Day on Wednesday, June 22 in Lucerne, Switzerland.
Indium Corporation Expert to Present at iMAPS SiP Conference
May 19, 2022
Indium Corporation’s Strategic Advisor Dr. Dongkai Shangguan will share his technical insight and expertise on advanced packaging at the Advanced System in Package Technology Conference & Exhibition, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), on Tuesday, June 21 in Sonoma, Calif., U.S.
Indium Corporation Experts to Present at ICEHET in Toronto
May 18, 2022
Indium Corporation experts Dr. HongWen Zhang, R&D manager – alloy group, and Dr. Ronald Lasky, senior technologist, are set to deliver presentations at SMTA’s International Conference for Electronics Hardware Enabling Technologies (ICEHET) in Toronto, Ontario, June 14-15.
Indium Corporation President and COO, Ross Berntson, Inducted into MACNY Manufacturers Wall of Fame
May 13, 2022
Indium Corporation President and Chief Operating Officer, Ross Berntson, was inducted by the Manufacturers Association of Central New York (MACNY) into its Manufacturers Wall of Fame during the organization’s 109thAnnual Celebration of Manufacturing on Thursday, May 12 at the SRC Arena and Events Center in Syracuse.
Indium Corporation Expert to Present on EV at IPC Works Asia Webinar
May 10, 2022
Indium Corporation’s Leo Hu, senior area technical manager– East China, will share his technical expertise and insight on electric vehicles (EV) during a webinar hosted by IPC China on Friday, May 20. His presentation, Advanced Assemblies Requirements for Electrical Reliability in Automotive Applications, will focus on the rapidly changing operating conditions of electronic assemblies.
Indium Corporation, KATEK to Present Joint Process Development at SMTconnect
May 5, 2022
Indium Corporation expert Andreas Karch, regional technical manager and technologist – advanced applications, and Ralf Sedlatschek, head of technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m.-Noon, Nuremberg, Germany.
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at International Microwave Symposium
May 4, 2022
Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at the International Microwave Symposium, Denver, Colo., June 19–24.
Indium Corporation Launches Rel-ion™ Technology for e-Mobility
May 3, 2022
With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation® is announcing a line of material solutions for e-Mobility. The Rel-ion™ suite of electrical, mechanical, and thermal solutions are designed to be reliable, scalable, and proven materials, reducing electric vehicle (EV) manufacturers' time to market.
Indium Corporation to Present at International Microwave Symposium
April 29, 2022
One of the most highly demanded applications for 80Au/20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. However, a key challenge with semiconductor lasers is thermal management, as these devices generate a significant amount of heat. Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at the International Microwave Symposium, Denver, Colo., June 19–24.
Solder Chemistry to Feature Solder Paste at SMTConnect
April 28, 2022
Solder Chemistry will feature two of its proven solder paste solutions at SMTConnect, May 10-12 in Nuremberg, Germany.
EV Experts to Share Technical Insights in Reliability Webinar
April 27, 2022
As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion™ Technical Webinars, Indium Corporation's EV experts are excited to announce the second webinar in this series.
Indium Corporation Features High-Reliability Auto Products at SMTconnect
April 26, 2022
Indium Corporation® will feature selections from its portfolio of high-reliability automotive solutions at SMTconnect, May 10-12 in Nuremberg, Germany.
Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX
April 25, 2022
Indium Corporation® will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, May 1-4 in Mesa, Ariz., U.S.
Indium Corporation Experts to Present at PCIM e-Mobility Forum
April 22, 2022
Indium Corporation experts will share their technical insight and knowledge on automotive and electric vehicle (EV) materials solutions as part of an e-Mobility forum at PCIM Europe, May 10-12, Nuremberg, Germany.
Indium Corporation’s Dawn Roller Honored by YWCA Mohawk Valley
April 21, 2022
Indium Corporation Associate Vice President of Human Resources, Dawn Roller, was honored by YWCA Mohawk Valley during its 33rd annual Salute to Outstanding Women reception on Thursday, April 21 at Hart's Hill Inn in Whitesboro, New York.
Indium Corporation Expert to Present at Electronic Components and Technology Conference
April 20, 2022
Indium Corporation® Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.
Indium Corporation Expert to Present at SiP Conference China
April 19, 2022
Indium Corporation®’s Leo Hu, senior area technical manager – East China, will share the challenges and solutions of fine feature solder paste printing for system-in-package (SiP) at SiP Conference China, May 19, Shanghai, China.
Indium Corporation to Feature Proven Products for Advanced Packaging at ECTC
April 18, 2022
Indium Corporation will feature its innovative products for advanced packaging at Electronic Components and Technology Conference (ECTC), May 31-June 3, in San Diego, Calif., U.S.
Indium Corporation’s Dr. Ron Lasky to Present InSIDER Series Webinar on SMTA Certification
April 15, 2022
Indium Corporation’s Dr. Ron Lasky will share his insight on SMTA certification as part of the company’s popular InSIDER Series of webinars. The presentation, Are You a Candidate for SMTA Certification?, will take place on Tuesday, May 17 at 10:30 a.m. San Francisco/1:30 p.m. New York/6:30 p.m. London/7:30 p.m. Germany.
Indium Corporation to Present on e-Mobility at SMTA Michigan
April 14, 2022
Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Michigan Expo & Tech Forum at 9 a.m. local time, Tuesday, May 17, Livonia, Mich., U.S.
Indium Corporation Expert Named to iNEMI Board of Directors
April 13, 2022
Indium Corporation Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., M.Sc., has taken on a new role on the iNEMI Board of Directors.
Indium Corporation Introduces New Adhesive Solution for Semiconductor Applications at PCIM Europe
April 12, 2022
Indium Corporation is announcing the release of InTACK™, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany.
Indium Corporation’s Dr. Ron Lasky to Present on Design of Experiments in Upcoming Webinar
April 11, 2022
Indium Corporation’s Dr. Ron Lasky will share his technical insight on the importance of Design of Experiments to optimize the electronics assembly process as part of the company’s popular InSIDER Series of webinars. The presentation, Design of Experiments (DOE) for SMT 101, will take place on Tuesday, May 3, at 10:30 a.m. San Francisco/1:30 p.m. New York/6:30 p.m. London/7:30 p.m. Germany.
Indium Corporation President to Deliver TestConX Keynote on Materials Science Innovations
April 7, 2022
Indium Corporation's Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held May 1-4, in Mesa, Ariz., US.
Berntson will be presenting on Monday, May 2 at 9 a.m.
Indium Corporation’s Dr. HongWen Zhang to Present InSIDER Series Webinar
April 5, 2022
Indium Corporation’s Alloy Group R&D Manager Dr. HongWen Zhang will deliver a presentation on the company’s award-winning Durafuse™ mixed-alloy technology as part of its popular InSIDER Series of webinars. The presentation, titled Solder Challenges and Product Development with Durafuse™ Technology, will be given on Wednesday, April 27 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.
Sixteen Indium Corporation Experts Certified by SMTA
April 4, 2022
Indium Corporation is pleased to announce that 16 employees have earned SMTA certification as part of its ongoing mission to invest in its technical talent to ensure customer success through professional development.
Indium Corporation Expert Dr. HongWen Zhang to Present at ICEP
March 31, 2022
Indium Corporation’s Alloy Group R&D Manager Dr. HongWen Zhang will present on a high-temperature lead-free solder paste at the International Conference on Electronics Packaging (ICEP), supported by the International Microelectronics Assembly and Packaging Society (IMAPS), May 11-14 in Hokkaido, Japan.
Indium Corporation Announces Job Fair, 40 Immediate Openings
March 30, 2022
Indium Corporation has immediate openings for Production Operators and other positions at its Rome and Clinton facilities and is offering prospective employees the opportunity for immediate interviews as part of its job fair from 9 a.m.-4 p.m. Thursday, April 7, at the Innovare Advancement Center at 592 Hangar Road in Rome (located in the Griffiss Business & Technology Park).
Indium Corporation Announces Promotion of Amy Schultz
March 29, 2022
Indium Corporation is proud to announce that Amy Schultz has been promoted to the position of senior specialist I, based at the company headquarters in Clinton, New York.
Indium Corporation to Present on e-Mobility at SMTA Atlanta
March 24, 2022
Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Atlanta Expo & Tech Forum at 10:30 a.m. local time, Tuesday, April 20, Peachtree Corners, Ga., U.S.
EV Experts to Share Technical Insights with Driving e-Mobility: Rel-ion™ Technical Webinars
March 23, 2022
As part of its popular InSIDER Series of webinars, Indium Corporation is excited to launch a new series focusing on the opportunities and challenges present in the rapidly evolving electric vehicle market, Driving e-Mobility: Rel-ion™ Technical Webinars.
Indium Corporation to Present at SMTA Boise
March 17, 2022
Indium Corporation's Claire Hotvedt, CSMTPE, product development specialist, will present on low-temperature solders for printed circuit board (PCB) assembly at the SMTA Boise Expo & Tech Forum at 1 p.m. on Tuesday, April 5 in Boise, Idaho, U.S.
Indium Corporation Expert to Participate in Defects Panel Discussion
March 15, 2022
Indium Corporation’s Adam Murling, assistant technical manager, will participate in a Global SMT & Packaging panel discussion on head-in-pillow (HIP) on Tuesday, April 19, at 7:30 a.m. California/10:30 a.m. New York/3:30 p.m. UK/4:30 p.m. Germany.
Indium Corporation to Feature Liquid Metal Thermal Solutions at SEMI-THERM
March 10, 2022
Indium Corporation will feature products from its line of proven gallium-based liquid metal thermal solutions at SEMI-THERM, March 21-25, San Jose, Calif., U.S.
Indium Corporation Expert to Present at SEMI-THERM
March 8, 2022
Indium Corporation’s Miloš Lazić, product development specialist, will share his industry knowledge on metal thermal interface materials (TIMs) in high-performance applications at SEMI-THERM, March 21-25, San Jose, Calif., U.S.
Indium Corporation Features High-Reliability Products for Power Electronics at CIPS
March 4, 2022
Indium Corporation will feature selections from its portfolio of high-reliability solutions for power electronics at the International Conference on Integrated Power Electronics (CIPS), March 15-17 in Berlin, Germany.
Indium Corporation to Host Reliability Webinar
March 3, 2022
The InSIDER Series—Indium Corporation’s free webinar program designed for professional development—has included more than 30 topics presented to thousands of industry professionals via its live sessions and recordings archive.
Indium Corporation Introduces Liquid Flip-Chip Flux
March 1, 2022
Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications.
Indium Corporation's Dr. Yan Liu Assumes Additional Role
February 24, 2022
Indium Corporation is pleased to announce that Dr. Yan Liu has assumed additional responsibilities within the company. In addition to serving as manager of the R&D Flux Group, she now manages the R&D team and laboratory at the company's Research & Development Center located in Suzhou, China. Dr. Liu now has oversight of R&D chemists working in North America and Asia.
Indium Corporation to Feature High-Reliability Products for Power Electronics at APEC
February 23, 2022
Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at APEC 2022, March 20-24, Houston, Texas, U.S.
Indium Corporation Expert to Participate in iNEMI Technical Series
February 22, 2022
Indium Corporation’s Tim Jensen, global account manager and senior thermal technologist, will participate in the International Electronics Manufacturing Initiative’s virtual Packaging Tech Topic series, offering his insights into the increased adoption of metal thermal interface materials (TIMs) in high-performance computing at 8 a.m. New York/2 p.m. Berlin/9 p.m. Beijing on Tuesday, March 8.
Indium Corporation to Present on e-Mobility at SMTA Rocky Mountain
February 17, 2022
Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Rocky Mountain Expo & Tech Forum, Thursday, March 10, Denver, Colo., U.S.
Indium Corporation to Present at IMAPS Device Packaging Conference
February 15, 2022
Indium Corporation's Evan Griffith, product specialist, will share his technical knowledge and insight on the evolution of solder paste for semiconductor applications at the International Microelectronics Assembly & Packaging Society (IMAPS) 18th International Conference and Exhibition on Device Packaging at 10:30 a.m. local time, Thursday, March 10 in Fountain Hills, Arizona, U.S.
Indium Corporation Expert to Present at APEC
February 10, 2022
The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporation’s Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
Indium Corporation to Present on e-Mobility at SMTA Dallas
February 8, 2022
Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Dallas Expo & Tech Forum at 9:15 a.m. local time, Tuesday, March 22 in Dallas, Texas, U.S.
Indium Corporation Announces Job Fair, 65+ Immediate Openings
February 7, 2022
Indium Corporation has immediate openings for Production Operators and other positions at its Rome and Clinton facilities and is offering prospective employees the opportunity for immediate interviews as part of its job fair from 9 a.m.-4 p.m. Thursday, Feb. 17, at Borza’s Recreation Center, 45 Seymour Lane in Westmoreland.
Indium Corporation Earns NSW Visionary Partnership Award
February 3, 2022
Indium Corporation has earned a Visionary Partnership Award from NSW Automation for the development of its innovative Indium12.8HF Solder Paste following an appreciation ceremony in January.
Indium Corporation Expert to Present at Wafer-Level Packaging Symposium
February 2, 2022
Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation by Dr. Dongkai Shangguan, strategic advisor, at the Surface Mount Technology Association’s Wafer-Level Packaging Symposium, Feb. 15-17, San Jose, Calif., U.S.
Indium Corporation Announces Personnel Updates at Clinton Facility
January 27, 2022
Indium Corporation is pleased to announce several personnel updates at the company’s facility located on Robinson Road in Clinton, New York.
Indium Corporation Expands Fine Wire Capabilities
January 25, 2022
Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004” (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications.
Indium Corporation Expert to Present at IEM
January 19, 2022
Durafuse™, Indium Corporation’s award-winning mixed-alloy technology, will be the focus of a virtual presentation by Dr. HongWen Zhang for the Institution of Engineers, Malaysia at 8 a.m. New York/9 p.m. Malaysia on Thursday, Feb. 24.
Indium Corporation to Host Power Electronics Webinar
January 18, 2022
The next offering in Indium Corporation's acclaimed InSIDER Series of webinars will be a discussion on the challenges with high-reliability power electronics assemblies and an overview of some of Indium Corporation's innovative materials solutions. Joe Hertline, product manager– ESM/Power Electronics, will host the webinar on Tuesday, Feb. 8 at 8 a.m. San Francisco/11 a.m. New York/4 p.m. London/5 p.m. Germany.
Indium Corporation Products ‘Live@APEX’
January 11, 2022
Indium Corporation will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Jan. 25-27, San Diego, Calif., U.S.
Live@APEX is a collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, its industry partners, and, most importantly, the customers who get to experience the equipment and materials in a live-action environment.
Indium Corporation Introduces Indalloy®291 Supplemental Bar Alloys
January 6, 2022
Indium Corporation announces that it is now offering supplemental bar alloys for Indalloy®291 wave solder pots designed to maintain recommended solder pot specifications.
Indium Corporation Senior Technologist’s Knowledge Showcased at SMTA PanPac
January 4, 2022
Indium Corporation’s Ron Lasky, Ph.D., PE, senior technologist, will share his industry knowledge and expertise during two presentations at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 31-Feb. 3, Honolulu, O’ahu, Hawaii, U.S.