Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia.
The presentation, Enabling AI with Metal TIM: Addressing Thermal Challenges Across TIM1, 1.5, and 2, will focus on the role of metal-based TIMs in addressing key challenges across TIM1, TIM1.5, and TIM2 interfaces, including the need to reduce thermal resistance, minimize voiding, and enhance mechanical reliability under thermal cycling. Metal TIMs provide high thermal conductivity, excellent structural stability, and reliable performance across a range of interface conditions, including warped or non-planar surfaces.
“As AI and HPC systems continue to advance, thermal management has become essential to support increasing power densities and packaging complexity,” said Foo. “By highlighting application insights and recent advancements, this presentation will provide a practical perspective on how metal TIMs are enabling next-generation AI and HPC packaging through more reliable, efficient thermal solutions.”
As assistant product manager at Indium Corporation, Foo plays a pivotal role in driving the company’s business development and expansion of engineered solder products across the Asia region. His responsibilities include delivering technical and commercial training on application technologies and products, as well as ensuring a comprehensive understanding for clients and stakeholders.
Foo earned a bachelor’s degree with honors in electronics engineering from Multimedia University in Malaysia. He is also a Six Sigma Green Belt and ISO 9000 certified.
The presentation will take place on Thursday, September 18, at 10:50 a.m.
To learn more about Indium Corporation’s solder solutions, visit https://www.indium.com/.
关于铟泰铟泰公司
铟泰公司®是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
