Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, May 10-13 in Mesa, Arizona, USA.
Indium Corporation’s wide portfolio of metal-based TIMs offers proven solutions for a wide variety of applications and process challenges:
- 挑战：导热性。散热是保持器件寿命和可靠性的关键。纯铟热弹簧®可提供均匀的热阻，最大限度地减少表面电阻，增加热流量。
- 挑战：处理和多次插入。HSMF-OS 是一种可压缩的 TIM，只有一面具有粘合特性，便于手工放置。它具有高拉伸强度（约 90 MPA）和柔软、顺应性好的聚合物衬底，提供了 "设计中 "的插入存活性配置。
- Challenge: pump-out. Because Indium Corporation’s products are made of metal, they won’t pump-out, even under power cycling.
To learn more about Indium Corporation’s metal thermal interface materials for burn-in and test, visit indiumstg.wpenginepowered.com/TIMs.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.
