Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo on March 15-17 in Las Vegas, Nev.
Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 and Indium8.9HF solder pastes to reduce voiding significantly below the industry average for improved finished goods reliability.
Indium10.1 delivers excellent print transfer and response-to-pause for low-voiding performance. In addition, it provides robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.
Halogen-free Indium8.9HF solder paste has a unique oxidation barrier technology that makes it perfectly suited for a variety of applications, especially automotive assembly.
In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill.
Indium10.1 and Indium8.9HF are part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes. For more information about Indium Corporation’s low-voiding solder paste, email [email protected] or visit indiumstg.wpenginepowered.com/avoidthevoid.
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
