Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo on March 15-17 in Las Vegas, Nev.
Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 and Indium8.9HF solder pastes to reduce voiding significantly below the industry average for improved finished goods reliability.
Indium10.1 具有出色的印刷转移和暂停响应能力，可实现低空洞性能。此外，它还具有强大的回流焊能力和宽广的处理窗口，可满足各种电路板尺寸和产量要求，并最大限度地减少缺陷。
无卤素铟 8.9HF 焊膏具有独特的抗氧化技术，非常适合各种应用，尤其是汽车装配。
除了出色的印刷转移性和卓越的停顿响应外，Indium10.1 和 Indium8.9HF 还具有出色的引脚锡膏可焊性和孔填充性。
Indium10.1 and Indium8.9HF are part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes. For more information about Indium Corporation’s low-voiding solder paste, email [email protected] or visit indiumstg.wpenginepowered.com/avoidthevoid.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
